Success Story

Leonardo optimizes electronic systems with Xpedition, HyperLynx, and Valor

Leonardo utilizes Xpedition, HyperLynx, and Valor to create complex electronic systems for military and civilian applications. About Leonardo Leonardo, based in Rome, Italy, serves…

23/10/2024

Nobo Auto optimizes PCB design with Xpedition & HyperLynx

Nobo Automotive accelerates time-to-market with an integrated PCB design process using Xpedition and HyperLynx verification. Innovating in a rapidly evolving automotive market Nobo Automotive…

18/09/2024

National Instruments cuts DFM time by 60% with Valor NPI

National Instruments leverages Valor NPI for DFM to enhance new product introduc-tion and production efficiency Business challenges Reduce the time it takes to run…

17/09/2024

Reduce Design Cycle at TOREX Semiconductor with Tanner

Tokyo-based TOREX Semiconductor (TOREX) specializes in developing analog (CMOS) power integrated circuits (ICs). Utilizing Siemens Tanner design tools, TOREX ensures its best-in-class ICs achieve…

13/09/2024

Reduce 37% machining time with VERICUT at iMFLUX

iMFLUX is a mold design and manufacturing company based in the US. iMFLUX offers automated molding with new capabilities to design and mold the…

30/08/2024

Improving technical education to prepare students for Industry 4.0 and to create complex thesis topics

Hanoi University of Industry uses Siemens solutions to improve student education and enrollment while reducing costs "Leveraging the Siemens Xcelerator business platform, the Smart…

29/08/2024

Testonica uses Tessent IJTAG to implement an FPGA-based reference system

At the 2023 European User2User conference, Artur Jutman, Director at Testonica, presents a workflow based on Tessent to implement an FPGA-based reference system for…

07/08/2024

Vietbay completed implementation of smart manufacturing and product lifecycle management solutions

With the orientation of bringing customers the best technical solutions and services. Vietbay has provided hundreds of customers with software solutions related to design…

02/08/2024

Technology News

Manufacturing Features Available In NX X Essentials

NX X Essentials offers an agile solution, by leveraging artificial intelligence (AI)-driven modeling and toolpath creation capabilities. It helps a…
Introducing NX X Essentials | Browser-based entry-level CAD/CAM/CAE

Browser-based essential NX CAD, CAM and CAE tools. Create and edit NX data in a lightweight experience, with zero translation,…
15 Fresh New Microsoft 365 Tips this 2025

Microsoft 365 is constantly updating and rolling out new features that are all designed around making our work easier, more…
Post Processor Service for NX CAM

Siemens NX CAM software is currently widely used in Vietnam due to its various advantages, such as the ability to…
Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor

Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development…
Microsoft 365 Copilot drove up to 353% ROI for small and medium businesses—new study

Recently, Microsoft announced impressive findings from a study conducted by Forrester Consulting, commissioned by Microsoft, on the projected economic impact…
Adobe’s New AI Tool Lets You Edit 10,000 Images at Once

Editing images with AI makes complex tasks a breeze, but given how computationally intensive it can be, it's tricky to…
Siemens launches new program to empower startups with cutting-edge technology

Siemens today launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups. Announced at CES 2025…
Leveraging the comprehensive digital twin for semiconductor

The semiconductor industry is on track to being worth $1 trillion by 2030. While accelerating demand will help semiconductors reach…
Microsoft Office Apps Soon Won’t Be Supported on Windows 10

Microsoft will stop supporting Office apps on Windows 10 beginning October 14, 2025, coinciding with the operating system’s upcoming end…
How to Increase ROI of Automotive Stamping Die and Press Line

Automotive stamping dies and press lines are high-cost, long lead-time investments. To maximize return on investment (ROI), it’s important to…
Designing chips in 2025

Products that run on software are integrated into our everyday lives. Smart devices and other software-defined products (SDP) are only…

Leonardo optimizes electronic systems with Xpedition, HyperLynx, and Valor

Nobo Auto optimizes PCB design with Xpedition & HyperLynx

National Instruments cuts DFM time by 60% with Valor NPI

Reduce Design Cycle at TOREX Semiconductor with Tanner

Reduce 37% machining time with VERICUT at iMFLUX

Improving technical education to prepare students for Industry 4.0 and to create complex thesis topics

Testonica uses Tessent IJTAG to implement an FPGA-based reference system

Vietbay completed implementation of smart manufacturing and product lifecycle management solutions

Search

Recent Posts

Manufacturing Features Available In NX X Essentials

Introducing NX X Essentials | Browser-based entry-level CAD/CAM/CAE

15 Fresh New Microsoft 365 Tips this 2025

Post Processor Service for NX CAM

Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor

Promotions

Benifits

Contact information

Technology News

Manufacturing Features Available In NX X Essentials

Introducing NX X Essentials | Browser-based entry-level CAD/CAM/CAE

15 Fresh New Microsoft 365 Tips this 2025

Post Processor Service for NX CAM

Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor

Microsoft 365 Copilot drove up to 353% ROI for small and medium businesses—new study

Adobe’s New AI Tool Lets You Edit 10,000 Images at Once

Siemens launches new program to empower startups with cutting-edge technology

Leveraging the comprehensive digital twin for semiconductor

Microsoft Office Apps Soon Won’t Be Supported on Windows 10

How to Increase ROI of Automotive Stamping Die and Press Line

Designing chips in 2025