News - Events - Vietbay

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking through, catching up, advancing…

05/08/2025

Closing Ceremony Of The First Training Courses Of IC Design And Electronic Systems Design In Vietnam Supported By Siemens

Hanoi, July 21, 2025 — The National Innovation Center (NIC), in collaboration with Siemens EDA and Vietbay Technology Company, held the closing ceremony of…

22/07/2025

Vietbay Participates in the P4G Vietnam 2025 Summit

On April 16–17, 2025, at the National Convention Center – Hanoi, Vietbay Technology Co., Ltd. participated in the 4th Partnering for Green Growth and…

12/05/2025

Free Training Program for PCB Design Software – PADS on Siemens Platform

PADS software provides a complete PCB design solution, including the following functionalities: Design Definition: schematic design, design rule entry, electrical rule checking, cross-probing with…

18/04/2025

Vietbay Participates in Dual-Use Technology Networking in the Defense Industry

On the morning of March 26 in Hanoi, the specialized seminar titled "Connecting Dual-Use Technology Achievements to Support Defense Industry Development" was successfully held.…

31/03/2025

Siemens – Vietbay participates in the AISC 2025 International Conference.

At the AI Summit & Conference (AISC) 2025, Siemens – Vietbay showcased a series of groundbreaking AI solutions and advanced semiconductor technologies that help…

19/03/2025

Siemens – Vietbay Introduces AI Technology for Semiconductors at the AISC 2025 International Conference

The International Conference on “Artificial Intelligence and Semiconductors 2025” (AISC 2025), themed "Shaping the Future: Connecting AI & Global Semiconductor Technology," will officially take…

11/03/2025

Siemens launches new program to empower startups with cutting-edge technology

Siemens today launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups. Announced at CES 2025 in Las Vegas, the…

11/02/2025

Technology News

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

In an era where unmanned aerial vehicles (UAV) are becoming the spearhead of both commercial and defense sectors, Elytron Aeronautica…
New Features on NX 2506 for Design

Built around industry-specific workflows, Siemens NX software is the “engine” behind the digital twin — delivering powerful, flexible tools to…
Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

CGTech officially launches Vericut version 9.6 (June 30, 2025), delivering a remarkable upgrade with artificial intelligence features and productivity improvements…
Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

UAVs are becoming a pillar in defense strategy and digital transformation for civil applications, and are being applied widely with…
Get the most out of OneDrive with these little-known features!

Collect information with Request Files Need to gather files from your team, your PTA board, or a dozen workshop attendees?…
How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…
What’s New in Cimco 2025 ?

Cimco software is currently a very popular solution among CNC machining engineers, offering a wide range of functional modules. These…
Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has…
Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking…
Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services…
Adobe Firefly New AI App Brings Generative Fill to Mobile

Generative Fill used to be locked away in Photoshop's desktop interface and Adobe's web tools. Now it's broken free into…
Introducing Xpedition Standard: Scalable PCB design power for growing teams

When it comes to electronics design, the demands on engineering teams have never been greater. From tight deadlines and limited…

News – Events

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Closing Ceremony Of The First Training Courses Of IC Design And Electronic Systems Design In Vietnam Supported By Siemens

Vietbay Participates in the P4G Vietnam 2025 Summit

Free Training Program for PCB Design Software – PADS on Siemens Platform

Vietbay Participates in Dual-Use Technology Networking in the Defense Industry

Siemens – Vietbay participates in the AISC 2025 International Conference.

Siemens – Vietbay Introduces AI Technology for Semiconductors at the AISC 2025 International Conference

Siemens launches new program to empower startups with cutting-edge technology

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Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Get the most out of OneDrive with these little-known features!

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Technology News

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Get the most out of OneDrive with these little-known features!

How can IC and package designers navigate the complexities of heterogeneous integration?

What’s New in Cimco 2025 ?

Siemens EDA and TSMC partner to advance 3D IC Design

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Adobe Firefly New AI App Brings Generative Fill to Mobile

Introducing Xpedition Standard: Scalable PCB design power for growing teams