Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor

Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development History The Electronics and…
21/02/2025

Increase loading capacity of scissor-lift by 50 percent with Simcenter

In the context of the increasingly intense global competition, businesses are required to continuously change and improve their products to meet the ever-growing demands…
15/01/2025

NVIDIA – Applying RTL Clock Gating (PowerPro) to Reduce Power Consumption in Graphics Processing Chips

Introduction Challenges in GPU Design: Modern GPUs need to deliver high performance for applications such as gaming, medical imaging, and industrial design. This requires…
23/12/2024

Purpose-Built AI Machines: Farm-ING is revolutionizing Agriculture for a Sustainable Future

Agriculture and technology have long been intertwined, from the invention of the cotton gin to today’s autonomous tractors. However, the future of farming is…
12/12/2024

Arm finds success with Siemens Aprisa place-and-route

Arm and Technology Entitlement in Chip Design Arm is a market leader in semiconductor IP, including interconnect technologies that serve as the backbone of many system-on-chips…
06/12/2024

MIPS leverages Siemens’ Veloce proFPGA platform to implement and make available capabilities of its new high-performance eVocore P8700 RISC-V multiprocessor

MIPS has issued a press release focused on its work with Siemens’ Veloce proFPGA platform. MIPS, a leading developer of highly scalable RISC processor…
25/11/2024

How Microsemi Uses Questa Formal Connectivity Check to Improve Quality and Productivity

Discover the optimal solution for verifying SoC connectivity with the Questa Formal Connectivity Check tool, helping Microsemi reduce risks, save time, and boost productivity…
18/11/2024

Siemens collaborates with Chipletz to develop advanced semiconductor packaging

Chipletz, a technology startup, has chosen Siemens technologies like Xpedition and HyperLynx to design and implement the packaging of its Smart Substrate product. Chipletz's…
25/10/2024

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