The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August 28th, industry leaders, innovators, and visionaries gathered in Santa Clara for the Global Technology Symposium (GTS) 2025 – a pivotal event where the roadmap for next-generation silicon was unveiled and discussed. For Siemens EDA, GTS 2025 underscored the critical importance of our advanced solutions in enabling the chips of tomorrow.
GTS 2025, renowned for its deep dive into cutting-edge process technologies, highlighted several key themes: the relentless march towards 2nm node, the increasing complexity of FinFET and Gate-All-Around (GAA) architectures, the imperative for enhanced power efficiency, and the growing role of AI/ML in design and manufacturing. Discussions revolved around overcoming the formidable challenges of variability, yield, and design-technology co-optimization (DTCO) at these ultra-fine geometries.
Crucially, the symposium delved into specific technology advancements and their applications:
- Ultra-low power CMOS: Sessions highlighted advancements in FinFET and FD-SOI technologies, coupled with advanced packaging, embedded memory, and mmWave, driving next-generation solutions for automotive, edge AI, smart mobile devices, and high-performance computing (HPC).
- Feature-rich CMOS: Emphasis was placed on high-efficiency, low-power consumption, and minimal leakage solutions for real-time processing applications, including AI, extending to industrial automation, smart homes, healthcare, wearables, and autonomous vehicles.
- RF Technologies: Discussions covered how RF SOI, SiGe, and RF GaN technologies are enabling reliable connections to the cloud while reducing size and power consumption across smart mobile, communications infrastructure, and datacenter markets, with a focus on Satcom.
- Silicon Photonics: This critical area was explored for its role in high-speed, energy-efficient data transmission, essential for modern datacenter scale-out and scale-up architectures.
- Power: Beyond general efficiency, the focus was on delivering peak power density and system efficiency with uncompromising long-term reliability for demanding datacenter and automotive applications.
The message was clear: designing and manufacturing at these advanced nodes is no longer just about shrinking features; it’s about mastering intricate physical effects and ensuring robust performance and yield in the face of unprecedented variability.
This is precisely where Siemens EDA’s Solido Custom IC solutions shine. As custom and analog/mixed-signal circuits become increasingly critical for high-performance computing, AI accelerators, and advanced connectivity, their sensitivity to manufacturing variations becomes a major bottleneck, especially in ultra-low power and feature-rich CMOS designs. Solido Custom IC platform offers a highly differentiated set of technologies to tackle the most complex challenges in modern Custom IC design.
The insights from GTS 2025 serve as a powerful reminder of the incredible innovation happening in our industry. Siemens EDA is proud to be at the forefront, providing the essential tools and expertise to turn these technological visions into reality.
(Source: Siemens)
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