AISC 2025 is an opportunity for Vietnam to access the latest information on the integration of AI and semiconductor technology while affirming the country’s increasingly important role in the global value chain of this high-potential industry.
The event focuses on the latest and most groundbreaking advancements of AI in revolutionizing chip design and manufacturing, along with the potential of advanced semiconductor architectures for AI. The three-day program, from March 12-14 in Hanoi, will include a variety of activities, including in-depth technical workshops, exhibitions, cross-border business networking, and a high-level policy forum with the participation of Vietnamese government leaders.
Siemens – Vietbay is proud to be present at AISC 2025. At our exhibition booth at NIC Hoa Lac on March 14, 2025, we will showcase the latest technology in IC semiconductor and PCB electronic board design, integrated with AI to address various challenges such as predictive AI algorithms to reduce computational requirements and enhance debugging with Predictive AI, and Generative AI models to increase design speed and optimize systems. For example, Calibre™ design and manufacturing solutions utilize AI to accelerate NPI (New Product Introduction) from design to mass production by providing faster and more accurate tools for DRC/LVS/PEX/DFM/REL verification, yield analysis, reliability optimization, as well as lithography modeling, RET, and OPC.
AI is not only applied in the electronics and semiconductor sectors. Siemens also strongly integrates AI into industrial software solutions such as NX, which automates the design, analysis, and manufacturing process. Features include adaptive UI/command prediction that adjusts to user habits, Next Generative Design for automatically generating optimal designs, chatbot applications that guide users, storing user habits and preset parameters for reuse, and personalized user interfaces.
Learn more about AI technology for semiconductors and other electronic products here:
- AI Solutions in Calibre and Xpedition: Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor
- AI Solutions in Tessent: How AI is accelerating semiconductor testing
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AI Solutions in NX: Introducing NX X Essentials | Browser-based entry-level CAD/CAM/CAE
- AI Solutions in NX Solid Edge: Purpose-Built AI Machines: Farm-ING is revolutionizing Agriculture for a Sustainable Future
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