Tag: IC design

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining third-party IPs into chiplets.…

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking through, catching up, advancing…

3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…

How AI is being utilized today Artificial Intelligence is no longer just a futuristic concept. It is actively shaping the way designers and engineers…

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and 3D ICs is reshaping…

Screenshot of the Calibre Interactive GUI showing multiple running jobs. The Calibre Multiple Job Submission (MJS) interface optimizes the IC design verification process As…

For the past few decades, the semiconductor industry has been ahead of the curve when it comes to digitalization. Even still, there are still…