3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…
In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and 3D ICs is reshaping…
Screenshot of the Calibre Interactive GUI showing multiple running jobs. The Calibre Multiple Job Submission (MJS) interface optimizes the IC design verification process As…
Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development History The Electronics and…
Products that run on software are integrated into our everyday lives. Smart devices and other software-defined products (SDP) are only due to become more…