Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and 3D ICs is reshaping…
21/05/2025

Keys To Successful ECAD-MCAD Collaboration

ECAD-MCAD collaboration is crucial In today’s complex world of product design and development. As product designs evolve, involving smaller IC packages and more densely…
14/05/2025

Easily Manage Multiple Verification Jobs with Calibre

Screenshot of the Calibre Interactive GUI showing multiple running jobs. The Calibre Multiple Job Submission (MJS) interface optimizes the IC design verification process As…
29/04/2025

Free Training Program for PCB Design Software – PADS on Siemens Platform

PADS software provides a complete PCB design solution, including the following functionalities: Design Definition: schematic design, design rule entry, electrical rule checking, cross-probing with…
18/04/2025

Manage complexity in chip design

For the past few decades, the semiconductor industry has been ahead of the curve when it comes to digitalization. Even still, there are still…
01/04/2025

How AI will enable DevOps for hardware

AI is bringing a new era of fast innovation in hardware design The ability to rapidly change and adapt is one of the hallmarks…
21/03/2025

Siemens – Vietbay Introduces AI Technology for Semiconductors at the AISC 2025 International Conference

The International Conference on “Artificial Intelligence and Semiconductors 2025” (AISC 2025), themed "Shaping the Future: Connecting AI & Global Semiconductor Technology," will officially take…
11/03/2025

Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor

Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development History The Electronics and…
21/02/2025