Introducing: PADS Pro Essentials
Independent engineers and small teams are constantly seeking ways to bring their innovative ideas to life. However, the high cost and complexity of professional-grade…
27/11/2025
Tag: Siemens EDA
Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC
From rapid library generation to precise analytics, Google and Siemens EDA latest collaboration presented at the Design Automation Conference (DAC) tackles some of the…
14/11/2025
Siemens – Vietbay Contributes to Advancing Vietnam’s Semiconductor Ecosystem at SEMIEXPO Vietnam 2025
Hanoi, November 7–8, 2025 – At the Vietnam Semiconductor Industry Exhibition 2025 (SEMIEXPO Vietnam 2025), Siemens – Vietbay showcased advanced semiconductor design and verification…
13/11/2025
Siemens – Vietbay Showcases Semiconductor Design Solutions at SEMIEXPO Vietnam 2025
Following the success of SEMIEXPO Vietnam 2024, SEMIEXPO Vietnam 2025 will officially take place from November 7–8, 2025 at VinPalace Cổ Loa Convention Center,…
18/10/2025
The Missing Piece for Chiplet Success
Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller, specialized “chiplets” designers can…
16/10/2025
Solido Custom IC at GTS 2025
The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August 28th, industry leaders, innovators,…
03/10/2025
How can IC and package designers navigate the complexities of heterogeneous integration?
Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining third-party IPs into chiplets.…
20/08/2025
Siemens EDA and TSMC partner to advance 3D IC Design
As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…
14/08/2025
