Tag: Siemens EDA

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller, specialized “chiplets” designers can…

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining third-party IPs into chiplets.…

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…

Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services (EMS) providers, has chosen…

Hanoi, July 21, 2025 — The National Innovation Center (NIC), in collaboration with Siemens EDA and Vietbay Technology Company, held the closing ceremony of…

When it comes to electronics design, the demands on engineering teams have never been greater. From tight deadlines and limited resources to the need…

First-pass design success using the Xpedition flow. Robert Turzo’s engineering cockpit for design and verification of electronic systems. Note the correlation between lab measurement…

3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…