3D-IC design using Calibre 3DSTACK
3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…
16/06/2025
Tag: IC
Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing
In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and 3D ICs is reshaping…
21/05/2025
Easily Manage Multiple Verification Jobs with Calibre
Screenshot of the Calibre Interactive GUI showing multiple running jobs. The Calibre Multiple Job Submission (MJS) interface optimizes the IC design verification process As…
29/04/2025
Manage complexity in chip design
For the past few decades, the semiconductor industry has been ahead of the curve when it comes to digitalization. Even still, there are still…
01/04/2025
How AI will enable DevOps for hardware
AI is bringing a new era of fast innovation in hardware design The ability to rapidly change and adapt is one of the hallmarks…
21/03/2025
Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor
Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development History The Electronics and…
21/02/2025
Leveraging the comprehensive digital twin for semiconductor
The semiconductor industry is on track to being worth $1 trillion by 2030. While accelerating demand will help semiconductors reach impressive gains, many chip…
10/02/2025
Designing chips in 2025
Products that run on software are integrated into our everyday lives. Smart devices and other software-defined products (SDP) are only due to become more…
05/02/2025
