Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor

Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development History The Electronics and…
21/02/2025

Leveraging the comprehensive digital twin for semiconductor

The semiconductor industry is on track to being worth $1 trillion by 2030. While accelerating demand will help semiconductors reach impressive gains, many chip…
10/02/2025

Designing chips in 2025

Products that run on software are integrated into our everyday lives. Smart devices and other software-defined products (SDP) are only due to become more…
05/02/2025

How AI is accelerating semiconductor testing

Microchips are some of the most complex devices on the planet and the design process that generates them is no less advanced, as first…
21/01/2025

NVIDIA – Applying RTL Clock Gating (PowerPro) to Reduce Power Consumption in Graphics Processing Chips

Introduction Challenges in GPU Design: Modern GPUs need to deliver high performance for applications such as gaming, medical imaging, and industrial design. This requires…
23/12/2024

Tessent SiliconInsight: A Comprehensive Solution for IC Debugging and Testing

The bring-up process of integrated circuits (ICs) involves several iterations through multiple steps spanning design, DFT (Design for Test), and test domains. As DFT…
16/12/2024

MIPS leverages Siemens’ Veloce proFPGA platform to implement and make available capabilities of its new high-performance eVocore P8700 RISC-V multiprocessor

MIPS has issued a press release focused on its work with Siemens’ Veloce proFPGA platform. MIPS, a leading developer of highly scalable RISC processor…
25/11/2024

Reduce Design Cycle at TOREX Semiconductor with Tanner

Tokyo-based TOREX Semiconductor (TOREX) specializes in developing analog (CMOS) power integrated circuits (ICs). Utilizing Siemens Tanner design tools, TOREX ensures its best-in-class ICs achieve…
13/09/2024