How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining third-party IPs into chiplets.…
20/08/2025

What’s New in Cimco 2025 ?

Cimco software is currently a very popular solution among CNC machining engineers, offering a wide range of functional modules. These include quick NC program…
19/08/2025

Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…
14/08/2025

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking through, catching up, advancing…
05/08/2025

Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services (EMS) providers, has chosen…
25/07/2025

Adobe Firefly New AI App Brings Generative Fill to Mobile

Generative Fill used to be locked away in Photoshop's desktop interface and Adobe's web tools. Now it's broken free into a mobile app you…
18/07/2025

Introducing Xpedition Standard: Scalable PCB design power for growing teams

When it comes to electronics design, the demands on engineering teams have never been greater. From tight deadlines and limited resources to the need…
15/07/2025

Can’t quit Windows 10? Here’s how to keep getting security updates after October 2025

Businesses can expect to pay a premium for Windows 10 Extended Security Updates, while educators will pay next to nothing. And for the first…
11/07/2025

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