Technology News

Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages of chip development. Particularly…

13/10/2026

Siemens EDA AI: How AI is transforming IC and PCB design?

As IC and PCB designs become increasingly complex, demands for computing power, simulation, and verification continue to grow. Optimizing workflows and reducing processing time…

10/10/2026

Adobe Acrobat AI hỗ trợ khai thác thông tin từ PDF

Adobe Acrobat AI: Turn PDFs into Visual Reports and Audio Summaries

A report spanning dozens of pages may contain exactly the information a business needs, but finding key figures, checking the details, and presenting the…

07/10/2026

Windows 11 26H2 và công tác chuẩn bị của doanh nghiệp

Windows 11 26H2 Released: What Should Businesses Prepare For?

On September 29, 2026, Microsoft released Windows 11, version 26H2, also known as the Windows 11 2026 Update. The update builds on versions 24H2…

05/10/2026

Robot hình người trong phát triển Physical AI

Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid robots are moving beyond…

02/10/2026

What Is CAM350? Key Features, User Reviews, and Its Journey into Siemens’ Portfolio

What Is CAM350? Valor CAM350 is a comprehensive, industry-standard toolset for verifying, optimizing, and exporting printed circuit board (PCB) manufacturing data. Today’s complex PCB…

29/09/2026

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…