Extending physical verification from the IC world to the advanced packaging world to improve multi-die package manufacturability. Use one Calibre 3DSTACK cockpit for assembly-level DRC, LVS, and PEX without disruption to traditional packaging formats and tools.
Key features
1. Multi-Die, System-Level Alignment/Connectivity Checks
The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5D and 3D stacked die designs. Designers can run signoff DRC and LVS checking of complete multi-die systems at any process node using existing tool flows and data formats.
2. Multi-Die/Die-on-Package/Interposer Alignment Checks
The Calibre 3DSTACK tool enables designers to check for accurate alignment between different die in a multi-die package assembly.
3. Multi-Die, System-Level Connectivity Checking
The Calibre 3DSTACK tool supports system-level connectivity checking for the multi-die package assembly, allowing designers to verify that dies, interposers and packages are connected as intended.
4. Interposer/Package Connectivity Checking
The Calibre 3DSTACK tool enables designers to check standalone interposer/package connectivity without including the individual die design databases.
Source: Siemens
