Chipletz, a technology startup, has chosen Siemens technologies like Xpedition and HyperLynx to design and implement the packaging of its Smart Substrate product.
Chipletz’s Business Challenges
Chipletz faces significant challenges, including:
- Meeting quality goals and time-to-market targets for large, complex assembly packages.
- Delivering customized integrated solutions to meet the increasing demands for computational performance and cost efficiency.
Objectives and Success Factors
Key factors contributing to Chipletz’s success include:
- Enhancing the efficiency and productivity of the design process.
- Reusing design intellectual property (IP) assets.
- The high capability and performance of Siemens’ design tools.
Products and Achievements
Chipletz utilized Xpedition Substrate Integrator, Xpedition Package Designer, and HyperLynx tools to design a demonstration vehicle, which resulted in:
- Reducing the number of metal layers from 16 to 9.
- Creating a design with more than 8,000 connections and 1.2 million vias.
This design supports ICs from various manufacturers, integrated through the Smart Substrate platform, offering die-to-die connectivity, high-speed I/O, and support for different voltage domains from a single power source.
Evaluation and Selection Process with Siemens
Chipletz conducted a thorough evaluation of Siemens’ technologies, based on criteria such as:
- Support for High Bandwidth Memory (HBM) channel design.
- Interaction performance on large, complex designs.
- Process automation and the ability to customize Design Rule Check (DRC) rules for Smart Substrate.
Siemens met Chipletz’s requirements, helping them complete their initial design on schedule and facilitating the development of advanced packaging solutions.
Chipletz Smart Substrate
Conclusion
With Siemens’ support, Chipletz successfully developed an advanced packaging technology platform, helping to overcome the slowdown of Moore’s Law and address increasing demands for computational performance. Chipletz plans to continue collaborating with Siemens to develop solutions addressing thermal management and thermal-induced mechanical stress, two areas where Siemens has proven expertise.
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