Siemens collaborates with Chipletz to develop advanced semiconductor packaging

Chipletz, a technology startup, has chosen Siemens technologies like Xpedition and HyperLynx to design and implement the packaging of its Smart Substrate product. Chipletz's…
25/10/2024

Leonardo optimizes electronic systems with Xpedition, HyperLynx, and Valor

Leonardo utilizes Xpedition, HyperLynx, and Valor to create complex electronic systems for military and civilian applications. About Leonardo Leonardo, based in Rome, Italy, serves…
23/10/2024

Nobo Auto optimizes PCB design with Xpedition & HyperLynx

Nobo Automotive accelerates time-to-market with an integrated PCB design process using Xpedition and HyperLynx verification. Innovating in a rapidly evolving automotive market Nobo Automotive…
18/09/2024

Xpedition Enterprise – PCB Design Software

Xpedition Enterprise is the industry’s most innovative PCB design flow, providing integration from system design definition to manufacturing execution. Its unique technologies can reduce…
22/02/2023