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Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel’s EMIB reference flow

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge…

07/03/2024

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Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has…
Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking…
Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

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Pleora Masters Multi-Board Design with HyperLynx & Xpedition

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Accelerated engineering for SMB

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Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel’s EMIB reference flow

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Get the most out of OneDrive with these little-known features!

How can IC and package designers navigate the complexities of heterogeneous integration?

What’s New in Cimco 2025 ?

Siemens EDA and TSMC partner to advance 3D IC Design

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

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Technology News

Get the most out of OneDrive with these little-known features!

How can IC and package designers navigate the complexities of heterogeneous integration?

What’s New in Cimco 2025 ?

Siemens EDA and TSMC partner to advance 3D IC Design

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

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Introducing Xpedition Standard: Scalable PCB design power for growing teams

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What’s new in NX CAM 2506

Pleora Masters Multi-Board Design with HyperLynx & Xpedition

Accelerated engineering for SMB