News

Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel’s EMIB reference flow

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge…

07/03/2024

Technology News

New pen tools and Draw tab customization in Word, Excel, and PowerPoint for Windows

On August 11, 2025, Microsoft rolled out an exciting new update for its Microsoft 365 apps on Windows: introducing two…
Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

In an era where unmanned aerial vehicles (UAV) are becoming the spearhead of both commercial and defense sectors, Elytron Aeronautica…
New Features on NX 2506 for Design

Built around industry-specific workflows, Siemens NX software is the “engine” behind the digital twin — delivering powerful, flexible tools to…
Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

CGTech officially launches Vericut version 9.6 (June 30, 2025), delivering a remarkable upgrade with artificial intelligence features and productivity improvements…
Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

UAVs are becoming a pillar in defense strategy and digital transformation for civil applications, and are being applied widely with…
Get the most out of OneDrive with these little-known features!

Collect information with Request Files Need to gather files from your team, your PTA board, or a dozen workshop attendees?…
How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…
What’s New in Cimco 2025 ?

Cimco software is currently a very popular solution among CNC machining engineers, offering a wide range of functional modules. These…
Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has…
Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking…
Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services…
Adobe Firefly New AI App Brings Generative Fill to Mobile

Generative Fill used to be locked away in Photoshop's desktop interface and Adobe's web tools. Now it's broken free into…

Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel’s EMIB reference flow

Search

Recent Posts

New pen tools and Draw tab customization in Word, Excel, and PowerPoint for Windows

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Promotions

Benifits

Contact information

Technology News

New pen tools and Draw tab customization in Word, Excel, and PowerPoint for Windows

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Get the most out of OneDrive with these little-known features!

How can IC and package designers navigate the complexities of heterogeneous integration?

What’s New in Cimco 2025 ?

Siemens EDA and TSMC partner to advance 3D IC Design

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Adobe Firefly New AI App Brings Generative Fill to Mobile