Technology News

Designcenter – A new era of product design and engineering from Siemens

As the manufacturing industry undergoes rapid transformation driven by Artificial Intelligence (AI), cloud computing, and Digital Twin technology, Siemens continues to advance its engineering…

27/10/2026

Nhà máy Siemens Erlangen ứng dụng AI và Digital Twin

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in its collaboration with NVIDIA…

21/10/2026

Designcenter Student Edition – tải xuống miễn phí dành cho sinh viên

Free Designcenter Student Edition: How to Download, Install, and Update

The new version of Designcenter Student Edition is now available free of charge. Register for and download Designcenter Student Edition through Siemens Software Center…

20/10/2026

Autodesk giới thiệu bản cập nhật AutoCAD 2027.1

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid foundation of AutoCAD 2027,…

19/10/2026

kham-pha-phien-ban-nang-cap-cimco-edit-ultra-va-core

CIMCO Edit Core and Ultra: Explore the Latest Features for CNC Machining

In CNC machining, errors in NC code or toolpaths can require program adjustments directly at the machine, prolong production preparation time, and increase the…

17/10/2026

Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages of chip development. Particularly…

13/10/2026

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…

Technology News

Designcenter – A new era of product design and engineering from Siemens

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Free Designcenter Student Edition: How to Download, Install, and Update

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

CIMCO Edit Core and Ultra: Explore the Latest Features for CNC Machining

Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

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Designcenter – A new era of product design and engineering from Siemens

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Free Designcenter Student Edition: How to Download, Install, and Update

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

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Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Up to 95% Off Siemens Software Licenses for Startups

Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

Humanoid Robotics: From Prototype to Real-World Deployment

Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design