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The International Conference on “Artificial Intelligence and Semiconductors 2025” (AISC 2025), themed "Shaping the Future: Connecting AI & Global Semiconductor Technology," will officially take…

Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development History The Electronics and…

Automotive stamping dies and press lines are high-cost, long lead-time investments. To maximize return on investment (ROI), it’s important to streamline development and commissioning…

The world of manufacturing is rapidly changing, driving the demand for effective part manufacturing and streamlined data management to meet ever-evolving market needs. In…

Celebrating the 10-year milestone of cooperation with Siemens DISW could not be more wonderful with 3 awards that Vietbay Tech received for the fiscal…

Now available, Solid Edge 2025 brings exciting updates, including Solid Edge X, Solid Edge software in a secure SaaS environment, with new tools to…

Chipletz, a technology startup, has chosen Siemens technologies like Xpedition and HyperLynx to design and implement the packaging of its Smart Substrate product. Chipletz's…

Hanoi University of Industry uses Siemens solutions to improve student education and enrollment while reducing costs "Leveraging the Siemens Xcelerator business platform, the Smart…