Solido Custom IC at GTS 2025
The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August 28th, industry leaders, innovators,…
03/10/2025
Tag: Siemens EDA
How can IC and package designers navigate the complexities of heterogeneous integration?
Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining third-party IPs into chiplets.…
20/08/2025
Siemens EDA and TSMC partner to advance 3D IC Design
As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…
14/08/2025
Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation
Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services (EMS) providers, has chosen…
25/07/2025
Closing Ceremony Of The First Training Courses Of IC Design And Electronic Systems Design In Vietnam Supported By Siemens
Hanoi, July 21, 2025 — The National Innovation Center (NIC), in collaboration with Siemens EDA and Vietbay Technology Company, held the closing ceremony of…
22/07/2025
Introducing Xpedition Standard: Scalable PCB design power for growing teams
When it comes to electronics design, the demands on engineering teams have never been greater. From tight deadlines and limited resources to the need…
15/07/2025
Pleora Masters Multi-Board Design with HyperLynx & Xpedition
First-pass design success using the Xpedition flow. Robert Turzo’s engineering cockpit for design and verification of electronic systems. Note the correlation between lab measurement…
07/07/2025
3D-IC design using Calibre 3DSTACK
3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…
16/06/2025
