3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…
ECAD-MCAD collaboration is crucial In today’s complex world of product design and development. As product designs evolve, involving smaller IC packages and more densely…
Screenshot of the Calibre Interactive GUI showing multiple running jobs. The Calibre Multiple Job Submission (MJS) interface optimizes the IC design verification process As…
At the AI Summit & Conference (AISC) 2025, Siemens – Vietbay showcased a series of groundbreaking AI solutions and advanced semiconductor technologies that help…
The International Conference on “Artificial Intelligence and Semiconductors 2025” (AISC 2025), themed "Shaping the Future: Connecting AI & Global Semiconductor Technology," will officially take…