3D-IC design using Calibre 3DSTACK

3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…
16/06/2025

The role of AI in electronic systems design

How AI is being utilized today Artificial Intelligence is no longer just a futuristic concept. It is actively shaping the way designers and engineers…
10/06/2025

Keys To Successful ECAD-MCAD Collaboration

ECAD-MCAD collaboration is crucial In today’s complex world of product design and development. As product designs evolve, involving smaller IC packages and more densely…
14/05/2025

Easily Manage Multiple Verification Jobs with Calibre

Screenshot of the Calibre Interactive GUI showing multiple running jobs. The Calibre Multiple Job Submission (MJS) interface optimizes the IC design verification process As…
29/04/2025

Manage complexity in chip design

For the past few decades, the semiconductor industry has been ahead of the curve when it comes to digitalization. Even still, there are still…
01/04/2025

How AI will enable DevOps for hardware

AI is bringing a new era of fast innovation in hardware design The ability to rapidly change and adapt is one of the hallmarks…
21/03/2025

Siemens – Vietbay participates in the AISC 2025 International Conference.

At the AI Summit & Conference (AISC) 2025, Siemens – Vietbay showcased a series of groundbreaking AI solutions and advanced semiconductor technologies that help…
19/03/2025

Siemens – Vietbay Introduces AI Technology for Semiconductors at the AISC 2025 International Conference

The International Conference on “Artificial Intelligence and Semiconductors 2025” (AISC 2025), themed "Shaping the Future: Connecting AI & Global Semiconductor Technology," will officially take…
11/03/2025