Featured Posts

Siemens-Vietbay Asserts Its Position at SemiExpo Vietnam 2024

Siemens-Vietbay participated in the Vietnam Semiconductor Industry Exhibition - SemiExpo Vietnam 2024, held at the NIC Hòa Lạc, Hanoi, from November 7-8, 2024. The…

14/11/2024

Vietbay-Siemens EDA Participates in Semicon Vietnam 2024

Vietbay-Siemens EDA took part in Semicon Vietnam 2024, the first international exhibition in Vietnam focused on the semiconductor industry, showcasing the latest technologies supporting…

14/11/2024

The Siemens-Vietbay Contribution at Innovate Vietnam 2024

Siemens-Vietbay was honored to receive the Innovation Booth Certificate from Minister of Planning and Investment Nguyen Chi Dung for its advanced solutions in the…

09/10/2024

Siemens EDA grants 1,200 software licences to Vietnamese learning institutions

Siemens EDA has announced it will be sponsoring 300 software licences in addition to the 900 advanced software licences for chip and circuit board…

26/08/2024

vn-launches-training-program-for-semiconductor-chip-design-instructors

Vietnam launches training program for semiconductor chip design instructors

Vietnam has embarked on a strategic initiative to strengthen its semiconductor industry by launching a comprehensive training program for university instructors in chip design.…

24/08/2024

Siemens – Vietbay sponsors the 9th international conference “Design and verification of integrated circuits” (ICDV 2024)

During the two days of June 6-7, the 9th international conference on "Design and Verification of Integrated Circuits" (ICDV 2024) took place in Hanoi.…

08/06/2024

Siemens and SHTP cooperated to improve skills for human resources in the semiconductor industry in Vietnam

Siemens Digital Industries Software and Ho Chi Minh City High-Tech Park (SHTP) have recently established a cooperation to develop talent and human resources for…

10/05/2024

Vietbay accompanies Siemens to organize the event Solid Edge University 2024: Unleash the Power of Intelligent Product Design

On April 25, 2024, Vietbay participated in the Solid Edge University 2024 event held at the NIC Building, 7 Ton That Thuyet, Cau Giay,…

25/04/2024

Technology News

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

In an era where unmanned aerial vehicles (UAV) are becoming the spearhead of both commercial and defense sectors, Elytron Aeronautica…
New Features on NX 2506 for Design

Built around industry-specific workflows, Siemens NX software is the “engine” behind the digital twin — delivering powerful, flexible tools to…
Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

CGTech officially launches Vericut version 9.6 (June 30, 2025), delivering a remarkable upgrade with artificial intelligence features and productivity improvements…
Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

UAVs are becoming a pillar in defense strategy and digital transformation for civil applications, and are being applied widely with…
Get the most out of OneDrive with these little-known features!

Collect information with Request Files Need to gather files from your team, your PTA board, or a dozen workshop attendees?…
How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…
What’s New in Cimco 2025 ?

Cimco software is currently a very popular solution among CNC machining engineers, offering a wide range of functional modules. These…
Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has…
Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking…
Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services…
Adobe Firefly New AI App Brings Generative Fill to Mobile

Generative Fill used to be locked away in Photoshop's desktop interface and Adobe's web tools. Now it's broken free into…
Introducing Xpedition Standard: Scalable PCB design power for growing teams

When it comes to electronics design, the demands on engineering teams have never been greater. From tight deadlines and limited…

Siemens-Vietbay Asserts Its Position at SemiExpo Vietnam 2024

Vietbay-Siemens EDA Participates in Semicon Vietnam 2024

The Siemens-Vietbay Contribution at Innovate Vietnam 2024

Siemens EDA grants 1,200 software licences to Vietnamese learning institutions

Vietnam launches training program for semiconductor chip design instructors

Siemens – Vietbay sponsors the 9th international conference “Design and verification of integrated circuits” (ICDV 2024)

Siemens and SHTP cooperated to improve skills for human resources in the semiconductor industry in Vietnam

Vietbay accompanies Siemens to organize the event Solid Edge University 2024: Unleash the Power of Intelligent Product Design

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Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Get the most out of OneDrive with these little-known features!

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Technology News

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Get the most out of OneDrive with these little-known features!

How can IC and package designers navigate the complexities of heterogeneous integration?

What’s New in Cimco 2025 ?

Siemens EDA and TSMC partner to advance 3D IC Design

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Adobe Firefly New AI App Brings Generative Fill to Mobile

Introducing Xpedition Standard: Scalable PCB design power for growing teams