Technology News

ZWCAD Enhanced Ordinate Dimension: Save Time for Annotate Coordinates

Enhanced Ordinate Dimension in ZWCAD is a time-saving feature for annotating coordinates in CAD drawings. It automates the process of dimensioning points, reducing errors,…

06/03/2024

Bridging the gap between semiconductor IP providers and integrators

On November 15, Microsoft announced the Cobalt 100 CPUs and Maia 100 AI accelerators during the Ignite event. The Maia, built on TSMC’s 5nm…

04/03/2024

Hình 1 . DRC ăng-ten truyền thống kiểm tra tỷ lệ diện tích giữa lớp kim loại và lớp cổng MOSFET (a) không có điốt bảo vệ và (b) có điốt bảo vệ.

Why PID issues matter to IC chip designers, and how to combat them

Integrated circuit (IC) chip designers are constantly striving to meet ever-increasing standards of reliability and performance in the fast-paced realm of semiconductor manufacturing. Amidst…

01/03/2024

Cutting time reduced from 9 days to 6 days with software alone!

VERICUT Force: Optimization of an Automotive Mold - Miju Precision Co., Ltd. MIJU PRECISION Co., Ltd., Located in Hwaseong City in South Korea, was…

01/03/2024

3D IC and the system-technology co-optimization (STCO) approach

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To overcome these challenges, teams…

29/02/2024

Intelligent Custom IC Verification: 6 Fundamentals for Success

Intelligent custom IC verification is revolutionizing the way our industry verifies the next generation of custom ICs, ensuring that they meet stringent power, performance,…

29/02/2024

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…