Technology News

Siemens SW Leonardo (Xpedition) Case Study.pdf-image-001

Leonardo optimizes electronic systems with Xpedition, HyperLynx, and Valor

Leonardo utilizes Xpedition, HyperLynx, and Valor to create complex electronic systems for military and civilian applications. About Leonardo Leonardo, based in Rome, Italy, serves…

23/10/2024

3 ways to use Outlook like a pro with Copilot

Microsoft Copilot is a powerful tool to improve productivity across Microsoft 365 products, including Outlook. Copilot in Outlook offers several capabilities for mail management…

21/10/2024

Top 3 features you might not know about CIMCO software

When it comes to Cimco software, most CNC machining technicians are familiar with Cimco Edit. This is a popular software that allows CNC machining…

18/10/2024

What’s new in NX: Core Design

The June 2024 release of NX has been enhanced with even more new and exciting features to help boost your productivity. In this post,…

17/10/2024

Discover All-in-One Construction Solutions with Trimble-Tekla

Trimble-Tekla provides comprehensive software solutions focused on Building Information Modeling (BIM), structural engineering, construction management, and collaboration within the Architecture, Engineering, and Construction (AEC)…

16/10/2024

3D Adaptive Roughing: Điểm bắt đầu đường chạy dao "Toolpath Start" và điểm khoan trước "Pre-Drill Points"

What’s new in NX CAM for manufacturing

NX CAM software features important enhancements based on the feedback from our users. Below we are highlighting the new capabilities that can help you…

11/10/2024

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…