Technology News

Bố cục Microsoft Teams đặt cạnh tài liệu Word trên cùng màn hình

Organize your digital environment and boost your focus with flexible Microsoft Teams layouts

The latest round of enhancements to Microsoft Teams, now rolling out to public preview, promises just that. In essence, users have more options to…

09/04/2025

AI Chat Copilot hỗ trợ thiết kế trong NX X

AI Chat Copilot on NX X: Intelligent Virtual Assistant to Optimize Design and Manufacturing Processes

Siemens NX X is a leading cloud-powered CAD/CAM software in the industry, and it has recently introduced the AI Chat Copilot feature in version…

08/04/2025

Cloud Tool Manager và các mô hình dụng cụ dùng trong lập trình gia công NX CAM

Step-by-step guide: implementing CAM software in your manufacturing workflow

A disconnected manufacturing workflow creates inefficiencies at every stage of part manufacturing—from design and programming to machining, inspection, and quality control. Integrating CAM software…

03/04/2025

Bảng trắng phân chia công việc bằng các giấy ghi chú màu

Integrating Microsoft Whiteboard: Connecting the Dots with Microsoft Teams, OneDrive, and More

Collaboration is most effective when tools work seamlessly together. Microsoft Whiteboard integrates with Microsoft Teams, OneDrive, and SharePoint, enabling nonprofits to streamline their workflows…

02/04/2025

Giải pháp quản lý thiết kế chip phức tạp

Manage complexity in chip design

For the past few decades, the semiconductor industry has been ahead of the curve when it comes to digitalization. Even still, there are still…

01/04/2025

5 Reasons Why Siemens NX X Is the Leading Design Solution

Siemens NX is the world’s leading CAD/CAM/CAE software, fully integrating design, simulation, and manufacturing tools. As the NX version on a cloud platform (Cloud…

24/03/2025

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…

Organize your digital environment and boost your focus with flexible Microsoft Teams layouts

AI Chat Copilot on NX X: Intelligent Virtual Assistant to Optimize Design and Manufacturing Processes

Step-by-step guide: implementing CAM software in your manufacturing workflow

Integrating Microsoft Whiteboard: Connecting the Dots with Microsoft Teams, OneDrive, and More

Manage complexity in chip design

5 Reasons Why Siemens NX X Is the Leading Design Solution

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Designcenter – A new era of product design and engineering from Siemens

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Free Designcenter Student Edition: How to Download, Install, and Update

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

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Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Up to 95% Off Siemens Software Licenses for Startups

Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

Humanoid Robotics: From Prototype to Real-World Deployment

Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design