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Is it time to upgrade from Microsoft Office? Everything you need to know.

As a leader of a small or medium-sized business, you may have invested in Microsoft Office years ago through a perpetual license or “on-premises”…

23/05/2025

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and 3D ICs is reshaping…

21/05/2025

Phân bố nhiệt độ trên mô hình thân động cơ với thang màu kết quả phân tích

AI-enabled design in NX

With Siemens being the first to introduce adaptive UI/command prediction into our CAD software, it’s no wonder that we continue to evolve NX by…

20/05/2025

Đồ họa so sánh OneDrive và SharePoint với hai biểu tượng đám mây

Mastering Cloud Storage: The Difference Between OneDrive and SharePoint

Your organization needs instant access to files. Both OneDrive and SharePoint offer abundant storage capacity. Which option is better? Let’s explore the differences between…

16/05/2025

Banner ZWCAD 2026 với mô hình kiến trúc và giao diện thiết kế

Introducing ZWCAD 2026: Design with Speed, Innovate with Ease

On May 8, 2025 – ZWSOFT, a trusted provider of all-in-one CAx solutions, proudly announces the official release of ZWCAD 2026, the latest evolution…

15/05/2025

Minh họa phối hợp ECAD–MCAD với mô hình 3D bảng mạch, đầu nối và bộ tản nhiệt

Keys To Successful ECAD-MCAD Collaboration

ECAD-MCAD collaboration is crucial In today’s complex world of product design and development. As product designs evolve, involving smaller IC packages and more densely…

14/05/2025

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…