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Bố trí mạch với nhiều lớp đường kết nối trong thiết kế đóng gói vi mạch

Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…

14/08/2025

Thủ tướng Phạm Minh Chính tại phiên họp về phát triển ngành công nghiệp bán dẫn

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking through, catching up, advancing…

05/08/2025

Dây chuyền sản xuất bảng mạch điện tử với kỹ thuật viên vận hành thiết bị

Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services (EMS) providers, has chosen…

25/07/2025

Minh họa chỉnh sửa ảnh nhiều lớp và điều chỉnh màu trong Photoshop trên điện thoại

Adobe Firefly New AI App Brings Generative Fill to Mobile

Generative Fill used to be locked away in Photoshop's desktop interface and Adobe's web tools. Now it's broken free into a mobile app you…

18/07/2025

Giải pháp thiết kế PCB Xpedition Standard

Introducing Xpedition Standard: Scalable PCB design power for growing teams

When it comes to electronics design, the demands on engineering teams have never been greater. From tight deadlines and limited resources to the need…

15/07/2025

Biểu tượng Windows 10 Updates trên nền màu xanh

Can’t quit Windows 10? Here’s how to keep getting security updates after October 2025

Businesses can expect to pay a premium for Windows 10 Extended Security Updates, while educators will pay next to nothing. And for the first…

11/07/2025

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…

Siemens EDA and TSMC partner to advance 3D IC Design

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Adobe Firefly New AI App Brings Generative Fill to Mobile

Introducing Xpedition Standard: Scalable PCB design power for growing teams

Can’t quit Windows 10? Here’s how to keep getting security updates after October 2025

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Designcenter – A new era of product design and engineering from Siemens

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Free Designcenter Student Edition: How to Download, Install, and Update

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

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Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Up to 95% Off Siemens Software Licenses for Startups

Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

Humanoid Robotics: From Prototype to Real-World Deployment

Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design