Technology News

Top Key Advantages Of NX X Over Traditional NX

Following the global shift toward cloud computing, Siemens has continuously advanced its Software as a Service (SaaS) solutions in recent years, enabling businesses to…

03/02/2026

Phân bố ứng suất trên mô hình kết cấu dạng khung trong SimSolid

Fast Design, Fast Simulation: CAE Technology For The Speed Era With SimSolid

For years, structural simulation (FEA) has been tied to a workflow of geometry preparation – meshing – refinement – computation. This process often consumes…

27/01/2026

Minh họa hợp tác Samsung Foundry và Siemens EDA với các công nghệ FinFET, EUV và GAA nanosheet

Forging the Future of Library Verification with AI-Powered Custom IC Design and Verification Solutions

In a compelling presentation that captivated audiences at the Siemens User2User North America 2025 Conference, Dongsuk Lee, Principal Engineer at Samsung Foundry, unveiled how…

27/01/2026

Edge Ai Đang Thay Đổi Industrial Internet Of Things (IIoT): Giải Pháp Thông Minh Cho Nhà Máy 4.0

Edge AI Transforming Industrial Internet of Things

The Industrial Internet of Things (IIoT) is evolving rapidly, and Edge AI has emerged as one of its most transformative developments. Sathishkumar Balasubramanian, Head…

27/01/2026

Valor Process Preparation

Complete engineering solution for PCB assembly and test Introduction about Valor Process Preparation Valor® Process Preparation solution provides manufacturers with everything they need to…

31/12/2025

Banner giới thiệu PADS Pro Essentials với hình minh họa thiết kế bảng mạch

Introducing: PADS Pro Essentials

Independent engineers and small teams are constantly seeking ways to bring their innovative ideas to life. However, the high cost and complexity of professional-grade…

27/11/2025

Featured Posts

Siemens EDA – Vietbay Partners with Leading Semiconductor Companies at SEMIEXPO Vietnam 2026

Following two successful editions in Hanoi, SEMIEXPO VIETNAM 2026 will be held in southern Vietnam for the first time. The…
Siemens and NVIDIA Bring AI to Factories: From Digital Twins to Autonomous Manufacturing

Artificial intelligence is rapidly moving beyond computer screens and into real-world manufacturing environments. Siemens has recently announced major advances in…
AutoCAD 2027.1 Update: Smarter AI, Enhanced Collaboration, and Performance

Autodesk has introduced the AutoCAD 2027.1 update, bringing new improvements to help you work more efficiently. Built on the solid…
Up to 95% Off Siemens Software Licenses for Startups

For startups in the early stages of development, software costs are an investment that requires careful consideration, especially when financial…
Calibre Vision AI: More Efficient DRC Analysis and Debugging in IC Design

As IC and SoC designs become larger and more complex, physical verification is becoming one of the more time-consuming stages…
CEO Vietbay attended the Launch Event of SemiExpo Vietnam 2026

On October 1, 2026, the Launch Event of SemiExpo Vietnam 2026 was held in Hanoi, bringing together leaders from SEMI…
Humanoid Robotics: From Prototype to Real-World Deployment

From an impressive prototype to a humanoid robot platform ready for industrialization Humanoid robotics is entering a new phase. Humanoid…
Xpedition Standard: Optimizing PCB Design Cycles by Up to 50%

Modern PCB design workflows are becoming increasingly complex, placing immense pressure on businesses regarding product development costs and time-to-market. Join…
ZW3D WuKong – An Affordable Integrated Technology Solution for SMEs

In industrial manufacturing, companies are increasingly dealing with more complex products, larger assemblies, and frequent design changes. At the same…
ZWCAD Network License: A Cost-Effective Licensing Solution for Small and Medium-Sized Businesses

2D drawings remain essential in architecture, construction, mechanical engineering and manufacturing. Businesses use them to design products, carry out projects…
Vietbay Experts Share Innovative Approaches to MCAD & ECAD Integration

On September 18, 2026, the TechTalk themed "Design Automation and MCAD & ECAD Integration," organized by Vietbay Technology Co., Ltd.,…
Thermal Optimization for 3D ICs: From Hotspot Detection to Chip–Package–System Co-Design

When multiple dies are vertically integrated in a 3D IC architecture, thermal management can no longer be treated as a…