Bố trí mạch với nhiều lớp đường kết nối trong thiết kế đóng gói vi mạch

Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…
14/08/2025
Quy trình Calibre 3DSTACK gồm căn chỉnh vật lý, kiểm tra kết nối và trích xuất ký sinh

3D-IC design using Calibre 3DSTACK

3D-IC technology is gaining attention as an alternative to complement Moore’s Law, which is approaching its physical limits. Unlike traditional 2D IC design, 3D-IC…
16/06/2025
Thiết kế IC 3D cho sản xuất với Siemens

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and 3D ICs is reshaping…
21/05/2025