New Products & Solutions

Solid Edge introduces new add-ons for Simcenter FLOEFD integration

Simcenter FLOEFD™ for Solid Edge® delivers the industry’s leading computational fluid dynamics (CFD) analysis tool for fluid flow and heat transfer. Fully embedded in…

30/01/2023

Stop wasting valuable time trying to find product design data

Doesn’t the saying go, “work smarter, not harder?” Yet, electronics manufacturers make enormous investments into engineering teams, software tools and technology to support every…

30/01/2023

Solid Edge 2D Nesting: Optimize cutting patterns, saving time and material costs.

With Solid Edge 2D Nesting, generate optimized layouts for the two-dimensional cutting of fabrication materials, including sheet metal, plastic, wood, fabric and textiles. 2D…

30/01/2023

NX X SaaS Openness and Integration for Rapid Innovation

[caption id="attachment_16187" align="aligncenter" width="725"] Portrait of Young Latina Marketing Specialist Working on Laptop Computer in Busy Creative Office Environment. Beautiful Diverse Multiethnic Female Project…

30/01/2023

Overcoming Design Complexity with Increased Productivity from your CAD Solutions

Manufacturers are under more pressure than ever to design innovative products. These products incorporate more electronic and software components. In a modern world, this…

30/01/2023

AutoCAD 2023 Unveiled: Experience Deeper Insights, Collaboration, and Automation

New AutoCAD 2023 features are here to further automate processes and collaboration. Whether you need to add feedback to your drawings, see insights to…

30/01/2023

Enhance electronics and mechanical design with NX Flexible Printed Circuit Design

Following the updates from last months NX release, we want to be able to bring you more details surrounding the different applications within NX. This…

30/01/2023

Digital Twin for Industrial and Automation Machines

Solutions for designing, modeling and digitalizing industrial machines, automation machines to meet diversified and higher demand. The digital trend changes global manufacturing. Smart manufacturing,…

30/01/2023

Technology News

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

In an era where unmanned aerial vehicles (UAV) are becoming the spearhead of both commercial and defense sectors, Elytron Aeronautica…
New Features on NX 2506 for Design

Built around industry-specific workflows, Siemens NX software is the “engine” behind the digital twin — delivering powerful, flexible tools to…
Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

CGTech officially launches Vericut version 9.6 (June 30, 2025), delivering a remarkable upgrade with artificial intelligence features and productivity improvements…
Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

UAVs are becoming a pillar in defense strategy and digital transformation for civil applications, and are being applied widely with…
Get the most out of OneDrive with these little-known features!

Collect information with Request Files Need to gather files from your team, your PTA board, or a dozen workshop attendees?…
How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…
What’s New in Cimco 2025 ?

Cimco software is currently a very popular solution among CNC machining engineers, offering a wide range of functional modules. These…
Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has…
Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Prime Minister Pham Minh Chinh emphasized that "the whole country must be an army" with the spirit of accelerating, breaking…
Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Sat Nusapersada Boosts NPI and SMT Efficiency with Valor Process Preparation Sat Nusapersada, one of Indonesia’s largest Electronics Manufacturing Services…
Adobe Firefly New AI App Brings Generative Fill to Mobile

Generative Fill used to be locked away in Photoshop's desktop interface and Adobe's web tools. Now it's broken free into…
Introducing Xpedition Standard: Scalable PCB design power for growing teams

When it comes to electronics design, the demands on engineering teams have never been greater. From tight deadlines and limited…

Solid Edge introduces new add-ons for Simcenter FLOEFD integration

Stop wasting valuable time trying to find product design data

Solid Edge 2D Nesting: Optimize cutting patterns, saving time and material costs.

NX X SaaS Openness and Integration for Rapid Innovation

Overcoming Design Complexity with Increased Productivity from your CAD Solutions

AutoCAD 2023 Unveiled: Experience Deeper Insights, Collaboration, and Automation

Enhance electronics and mechanical design with NX Flexible Printed Circuit Design

Digital Twin for Industrial and Automation Machines

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Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Get the most out of OneDrive with these little-known features!

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Technology News

Elytron Aeronautica: Breaking Through with Technology in UAV Design and Manufacturing

New Features on NX 2506 for Design

Vericut 9.6 – A Smart Leap in CNC Simulation and Optimization

Solutions For Design And Performance Optimization Of Unmanned Aerial Vehicles (UAV)

Get the most out of OneDrive with these little-known features!

How can IC and package designers navigate the complexities of heterogeneous integration?

What’s New in Cimco 2025 ?

Siemens EDA and TSMC partner to advance 3D IC Design

Prime Minister: By 2027 at the latest, we must design, manufacture and test a number of necessary semiconductor chips.

Sat Nusapersada Increases Efficiency by 33% Using Valor Process Preparation

Adobe Firefly New AI App Brings Generative Fill to Mobile

Introducing Xpedition Standard: Scalable PCB design power for growing teams