Siemens EDA AI: How AI is transforming IC and PCB design?

As IC and PCB designs become increasingly complex, demands for computing power, simulation, and verification continue to grow. Optimizing workflows and reducing processing time…
10/10/2026
thiet-ke-layout-custom-ic-siemens-l-edit

L-Edit Custom IC: 4 Features to Improve IC Layout Design

In IC Design, physical placement, routing navigation, and layout debugging can take up a significant amount of engineering time. In this article, experts from…
20/08/2026
xac-minh-ams-voi-mixed-singal-visualizer

Mixed-Signal Visualizer: Simplify AMS Verification and Debugging

In operational theory, optimizing a bottleneck or critical path within a process can have a significant impact on overall efficiency. This principle is particularly…
15/08/2026
Thư mời Siemens – Vietbay tham dự SEMIEXPO Vietnam 2025 tại gian hàng 130 kèm chương trình sự kiện

Siemens – Vietbay Showcases Semiconductor Design Solutions at SEMIEXPO Vietnam 2025

Following the success of SEMIEXPO Vietnam 2024, SEMIEXPO Vietnam 2025 will officially take place from November 7–8, 2025 at VinPalace Cổ Loa Convention Center,…
18/10/2025
Giao diện thiết kế 3D IC hiển thị bố trí chiplet và cấu trúc xếp chồng nhiều lớp

The Missing Piece for Chiplet Success

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller, specialized “chiplets” designers can…
16/10/2025

Solido Custom IC at GTS 2025

The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August 28th, industry leaders, innovators,…
03/10/2025
Minh họa các chiplet tích hợp trên một đế đóng gói với các đường kết nối tỏa ra xung quanh

How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining third-party IPs into chiplets.…
20/08/2025
Bố trí mạch với nhiều lớp đường kết nối trong thiết kế đóng gói vi mạch

Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has become increasingly critical. 3D…
14/08/2025