Smarter, Faster AI Chip Design with Siemens’ 3D IC Packaging Technology at ETRI and Amkor

Business challenges Integration and verifcation of highly complex AI architecture Create next-generation ultra-performance AI NPU chiplets ETRI's AI NPU Development History The Electronics and…
21/02/2025

Designing chips in 2025

Products that run on software are integrated into our everyday lives. Smart devices and other software-defined products (SDP) are only due to become more…
05/02/2025