Search results for: HyperLynx

1. Overview of Xpedition Xpedition is a high-end Printed Circuit Board (PCB) from Siemens EDA. It is designed to support engineering teams across multiple…

Independent engineers and small teams are constantly seeking ways to bring their innovative ideas to life. However, the high cost and complexity of professional-grade…

From rapid library generation to precise analytics, Google and Siemens EDA latest collaboration presented at the Design Automation Conference (DAC) tackles some of the…

Hanoi, November 7–8, 2025 – At the Vietnam Semiconductor Industry Exhibition 2025 (SEMIEXPO Vietnam 2025), Siemens – Vietbay showcased advanced semiconductor design and verification…

Following the success of SEMIEXPO Vietnam 2024, SEMIEXPO Vietnam 2025 will officially take place from November 7–8, 2025 at VinPalace Cổ Loa Convention Center,…

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller, specialized “chiplets” designers can…

The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August 28th, industry leaders, innovators,…

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining third-party IPs into chiplets.…